MILPITAS, Calif., July 11, 2011 /PRNewswire/ -- Today KLA-Tencor Corporation™ (NASDAQ: KLAC), announced a new generation in the Surfscan® family of wafer defect and surface quality inspection systems: the Surfscan SP3. As the first unpatterned wafer inspection platform to incorporate deep-ultraviolet (DUV) illumination, the Surfscan SP3 systems feature dramatic advances in sensitivity and throughput over their industry-benchmark predecessor, the Surfscan SP2XP. The Surfscan SP3 platform is also designed for extension to the next wafer size: 450mm.  

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"Launching a new Surfscan platform is an exciting event for KLA-Tencor," said Ali Salehpour, senior vice president and general manager of the Surfscan / ADE division at KLA-Tencor. "The visible-light Surfscan SP1 and the UV-illuminated Surfscan SP2 were well received by the industry; in fact, Surfscan tools can be found in every leading-edge substrate and chip manufacturing facility. Now we're announcing the first DUV unpatterned wafer inspection platform, to satisfy the industry's need for increased sensitivity at production speeds at the 28nm device node and below. We believe that the Surfscan SP3 will carry the Surfscan reputation for excellence in substrate and integrated circuit (IC) process tool qualification into the next generation."

The Surfscan SP3 system is designed to help develop and manufacture substrates for < 28nm devices that are nearly atomically smooth and free from polish marks, crystalline pits, terracing, voids or other defects that disrupt the electrical integrity of the transistor. Because these defects cannot be reliably detected by current-generation inspection systems at production speeds, substrate manufacturers have had difficulty achieving satisfactory yields with these top-grade, next-node wafers. KLA-Tencor's engineers have built the Surfscan SP3 inspection system with the DUV sensitivity and throughput needed to reliably identify critical defects and surface quality issues inline during substrate manufacturing.

In the IC fab, manufacturers must also be able to monitor rough and smooth unpatterned films after deposition and chemical mechanical polish (CMP) to ensure that process tools are not adding defects. The Surfscan SP3 leverages its unique DUV wavelength, special apertures and multiple illumination and collection channels to address stringent 28nm node requirements for defect detection and classification on blanket films at production speeds. The SP3 also offers a module that inspects the back side of wafers for defects that might deform the wafer shape during photolithography.

The extensive capabilities of the Surfscan SP3 are enabled by the following new features and improvements over the current-generation Surfscan platform:

    --  Powerful DUV source and DUV-optimized optics, to help capture critical
        defects affecting devices at the 28nm node and below;
    --  New stage and new image computer that, together with algorithm
        improvements, enable increased production throughput;
    --  DUV-specific apertures that enhance defect capture on blanket films;
    --  Integrated, high resolution (~100 mega-pixel), full-wafer SURFmonitor™
        haze maps, providing automated capture of ultra-fine slip lines and
        scratches or maps of surface roughness, grain size and other process
        parameters; and
    --  Defect coordinate accuracy improvements that enhance re-detection and
        speed of defect review and classification on KLA-Tencor's eDR
        electron-beam review tools, allowing engineers to track down the source
        of a defect excursion quickly and disposition wafers accurately.

Surfscan SP3 tools can be matched among themselves and correlated to the factory's existing Surfscan SP2 and SP2XP baselines, to enhance fleet flexibility and factory productivity. To maintain high performance and productivity, the Surfscan SP3 tools are backed by KLA-Tencor's global, comprehensive service network.

Surfscan SP3 systems have been shipped to leading substrate and chip manufacturers in Asia, the United States and Europe for use in advanced development and production lines. For more information on KLA-Tencor's unpatterned wafer defect inspection systems, please visit the product web pages at: http://www.kla-tencor.com/front-end-defect-inspection/surfscan-series.html.

About KLA-Tencor:

KLA-Tencor Corporation (NASDAQ: KLAC), a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor, data storage, LED, photovoltaic, and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for over 30 years. Headquartered in Milpitas, California, KLA-Tencor has dedicated customer operations and service centers around the world. Additional information may be found at www.kla-tencor.com. (KLAC-P)

Forward Looking Statements:

Statements in this press release other than historical facts, such as statements regarding Surfscan SP3's expected performance, trends in the semiconductor industry (and the anticipated challenges associated with them), expected uses of the Surfscan SP3 by KLA-Tencor's customers, expected extendibility of the Surfscan platform to accommodate new functionality, and the anticipated cost, operational and other benefits realizable by users of the Surfscan SP3 tools, are forward-looking statements, and are subject to the Safe Harbor provisions created by the Private Securities Litigation Reform Act of 1995. These forward-looking statements are based on current information and expectations, and involve a number of risks and uncertainties. Actual results may differ materially from those projected in such statements due to various factors, including delays in the adoption of new technologies (whether due to cost or performance issues or otherwise), the introduction of competing products by other companies or unanticipated technological challenges or limitations that affect the implementation, performance or use of KLA-Tencor's products.

SOURCE KLA-Tencor Corporation