KLA-Tencor Introduces Complete Measurement Solution for Critical 45nm Wafer Geometry Metrology Requirements
SAN JOSE, Calif.--(BUSINESS WIRE)--
KLA-Tencor (NASDAQ:KLAC) today introduced the WaferSight 2, the semiconductor industry's first metrology system that enables wafer suppliers and chipmakers to measure bare wafer flatness, shape, edge roll-off and nanotopography in a single system with the high precision and tool matching required for 45nm and beyond. With industry-leading flatness and nanotopography precision, plus improved tool-to-tool matching, WaferSight 2 enables leading-edge production of next-generation wafers by wafer suppliers, and higher confidence of incoming wafer quality control for IC makers.
Studies by leading lithography system suppliers have shown that slight variations in wafer flatness can consume as much as 50% of the critical lithography depth of focus budget at 45nm. Building on the market leadership of KLA-Tencor's WaferSight 1 system, the fast and accurate 45nm-generation flatness measurement capability of the WaferSight 2 system can help both wafer makers and IC companies by enabling tighter flatness specifications for bare wafers, helping chipmakers overcome depth of focus challenges.
"At 45nm and beyond, variations in wafer flatness, shape and surface topography can have a more severe impact on process windows and yield for lithography and other manufacturing processes," said Jeff Donnelly, vice president of Growth and Emerging Markets at KLA-Tencor. "With improved optics and measurement isolation that enable higher resolution, matching and precision compared to the previous ADE WaferSight 1 system, the new WaferSight 2 helps wafer makers dramatically tighten their manufacturing specs to meet 45nm requirements, and also permits chipmakers to measure incoming wafers in order to ensure process quality for manufacturing. At the same time, the system's productivity reduces operating cost and improves efficiency."
Nanotopography control has become critical at the 45nm node because it is a cause of reduced process margin in CMP and can cause CD variation in lithography. The new WaferSight 2 system's improvements in precision provide industry-leading nanotopography measurement performance. It also is the first to measure both frontside and backside nanotopography in a single, non-destructive measurement.
By combining flatness and nanotopography in one system, the WaferSight 2 enables shorter cycle times, reduced WIP queuing and move times, smaller footprint, and more efficient facilities usage compared to multiple tool solutions. WaferSight 2 can also be seamlessly combined with KLA-Tencor's fab data management system FabVision(R), creating a package that enables offline analysis of archived or current metrology data, with fully customized charts and reports.
Christophe Maleville, vice president, SOI Products Platform at Soitec, a beta site partner for the WaferSight 2, said, "Our evaluation of the WaferSight 2 system demonstrated class-leading performance for all of the tool's measurement modes, with excellent long-term reproducibility and measurement stability. The system's advanced capabilities make it suitable for 45nm-generation production and WaferSight 2 has shown excellent reliability during the evaluation beta period and in production. This metrology system has been accepted for silicon and SOI production, and Soitec will make WaferSight 2 a key system for wafer geometry metrology going forward."
About KLA-Tencor: KLA-Tencor is the world leader in yield management and process control solutions for semiconductor manufacturing and related industries. Headquartered in San Jose, California, the Company has sales and service offices around the world. An S&P 500 company, KLA-Tencor is traded on the NASDAQ Global Select Market under the symbol KLAC. Additional information about the Company is available at http://www.kla-tencor.com.
Source: KLA-Tencor
Released December 2, 2007